Copper

OPTIMAL COVERING PROPERTY ON A VARIETY OF BASE MATERIALS

  • Ductility Ductility
  • Solderable Solderable
  • Low contact resistance Low contact resistance

IDEAL FOR LOW CONTACT RESISTANCES

The high-performance copper process for steel, copper alloys, etc., has an outstanding covering property, good metal distribution and, thanks to the low inherent stress of the deposits, high adhesive stress even in thicker layers. Suitable for rack and barrel plating processes.

  • Low contact resistance
  • Solderable
  • Ductile

Info sheet ODU surface engineering

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